Intel will finalize a 3nm deal with TSMC this month as pilot production begins

Taiwan Semiconductor Manufacturing Company (TSMC) has begun pilot production of its next generation 3 nanometer semiconductor manufacturing node. The report, courtesy of Taiwan’s Digitimes publication, also states that executives from US chip company Intel Corporation will visit Taiwan later this month to finalize the 3nm process. TSMC’s manufacturing technologies often have limited capacity during the early stages of their lives, making only a few companies able to acquire products manufactured by them.

TSMC’s initial 3nm production capacity will be limited to 40,000 wafers per month, the report said

The report on the 3nm pilot production comes between TSMC and Samsung Foundry, the semiconductor manufacturing arm of the Korean chaebol Samsung Group, when it comes to the expected mass production timelines for next-generation semiconductor manufacturing technologies. Is. While Samsung expects its 3nm process to be completed in the first half of next year, TSMC chief executive officer Dr. CCV outlined that his company will start mass production of H2 during 2022. Will enter

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TSMC’s 3nm pilot production meets the kick-off Doctor V estimates made earlier this year on an investor’s call. Her company is marketing the most advanced manufacturing technology ever, and she is confident that she will be able to make a profit in the years to come.

As transistor size continues to shrink, it takes years for chip makers to develop new technologies, even as TSMC maintains that it is on track to double the efficiency of its process technology every two years.

Furthermore, as stated. chiakokhua On Twitter, Intel is anxious to make sure it is at the forefront when it comes to purchasing TSMC’s 3nm products. In general, the latest of the Taiwanese company’s manufacturing lines is thought to go to Apple, Inc., the latest silicon of Cupertino tech company, which then sells them to retain its technical advantages in smartphones and notebooks. Uses.

The TSMC presentation slide outlines its roadmap for the semiconductor manufacturing process. Photo: TSMC

According to @chiakokhua, who also cites Digitimes:

Intel execs to visit Taiwan in mid-December:

– Finalize the scope of cooperation with TSMC.

– Request / make sure N3 capability is not affected by Apple.

– Start a conversation about cooperation for N2.

– The first wave of N3 capacity <60K, will reach only 40K + wpm in 1H'23.

Rumors of companies seeking top positions from TSMC for its latest chip technologies have surfaced before, with Santa Clara semiconductor designer Advanced Micro Devices, Inc. (AMD) and San Diego firm Qualcomm Incorporated. Both have spread rumors that their Taiwanese counterpart prefers Samsung’s 3nm process. .

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More interestingly, Digitimes believes that Intel will also discuss cooperation with TSMC for the 2nm process, as the Santa Clara, California-based company also has plans for its 2nm node. According to Intel’s roadmap released in July this year, dubbed 20A (Ingstrom), the technology could reach production lines in 2024.

This could be a whole year ahead of TSMC’s 2nm node, which could enter production in 2025 if the previous hand estimates given by Dr. V turned out to be correct.

Intel’s collaboration with TSMC for the 3nm process has been reported since January 2021, and the latest report states that the pair will work together on graphics processing units (GPUs) and three data center central processing units (CPUs). ۔ Both are key products for Intel, which has not yet consolidated its position in the fast-growing GPU market and is competing with AMD in the data center segment. Demonstrating an increase in revenue.

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